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DTIC ADA474838: Next Generation Nanotechnology Assembly Fabrication... |
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by Defense Technical Information Center |
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Today, the continued success of many industries, |
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especially the microelectronics industry, relies upon the |
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ability to fabricate structures with nanometer precision. |
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The efforts toward developing nanometer-scale fabrication |
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methods fall loosely into two fields. One field seeks to |
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extend the current planar, deposit-pattern-etch paradigm |
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used for complementary metal oxide semiconductors (CMOS). |
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This is a top-down approach. The other seeks new |
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techniques to assemble structures without handling |
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individual particles: self-assembly. These techniques |
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take a bottom-up approach. The fundamental limits of the |
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materials used in the planar CMOS process, which has been |
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the basis for the semiconductor industry for the past 30 |
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years, are now being reached. This is driving industry to |
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fund research to find new fabrication methods. The thesis |
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of this paper is that as new fabrication methods are |
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mastered in the quest to continue advancement in computer |
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processing, these techniques will propagate to other |
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applications with the potential to threaten U.S. national |
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security interests. |
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Date Published: 2018-06-15 10:59:32 |
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Identifier: DTIC_ADA474838 |
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Item Size: 25137287 |
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Language: english |
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Media Type: texts |
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# Topics |
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DTIC Archive; Jovene, Jr, Vincent T ;... |
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