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DTIC ADA255096: Hybrid Microcircuit Assembly Manufacturing Process ...
by Defense Technical Information Center
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The Hybrid Microcircuit Assembly manufacturing process
parameters have been established in order to bring about
their recognition and control. The list is of generic
thin film, thick film and multi-chip modules constructed
with multi-layer green tape alumina and substrates. The
list starts with substrate fabrication and progressing
through to final assembly, inspection, and test. Once the
parameters have been fully recognized and completely
described, progress can be made in regulating the
parameters. This regulation will bring about cost
effective requirements and a higher quality product.
Another benefit will come from knowing the parameters
that need further scrutiny. The possible combining of
manufacturing functions or techniques can in the future
change the parameters but the new parameters can be
compared with the old.
Date Published: 2018-03-07 13:12:43
Identifier: DTIC_ADA255096
Item Size: 25584115
Language: english
Media Type: texts
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