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DTIC ADA097000: Hybrid Microcircuits, Fabrication and Assembly - St...
by Defense Technical Information Center
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This report discusses materials and techniques now being
used for the fabrication and assembly of hybrid
microcircuits. Hybrid technology provides the means for
assembling all major categories of electronics in
relatively small enclosures to fulfill size requirements
which cannot be met by more conventional packaging
techniques. Analog and digital circuits as well as
microwave modules are made in hybrid form. The design,
fabrication and testing of hybrid microcircuits are
included along with the present status of thin and thick
film components and assembly techniques. (Author)
Date Published: 2017-12-12 15:40:31
Identifier: DTIC_ADA097000
Item Size: 16950697
Language: english
Media Type: texts
# Topics
DTIC Archive; Pratt,Isaac H ; ARMY EL...
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