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3D Printing Integrated Circuits: What's Possible Now and in the Future?

  [77]3D printing applications

  3d printing integrated circut The semiconductor industry gets a lot of
  attention—and for good reason. Integrated circuits make technology
  possible, and these devices are built on the back of semiconductors.
  Semiconductor manufacturing processes have come a long way since Robert
  Noyce invented the integrated circuit in 1959. With the rise of
  Industry 4.0 and the wide array of additive manufacturing processes,
  one naturally wonders whether the electronics industry will advance to
  3D printing integrated circuits at full scale.

  In this discussion, the question naturally arises: Why use additive
  manufacturing processes to produce integrated circuits? 3D printing is
  already being used to produce fully-functional PCBs with unique
  geometry, interconnect architecture, and various levels of component
  embedding. The ability to 3D print integrated circuits and other
  semiconductor devices directly into a PCB allows low-volume fabrication
  of highly specialized devices with unique form factor and capabilities.

  Silicon wafer with IC dies

  IC dies on a silicon wafer

The Current State of 3D Printing Integrated Circuits

  Silicon, III-V, and II-VI semiconductor manufacturing processes are
  highly advanced and are used to produce integrated circuits with less
  than 10 nm gate sizes. Currently, the most advanced 3D printing
  processes provide near micron-level resolution and co-deposition of
  multiple materials.

  Co-deposition is critical for 3D printing integrated circuits because
  conductors and semiconducting materials must be printed simultaneously.
  The resolution of the most advanced 3D printing systems must still
  improve before VLSI is possible. In addition to improving device
  performance, miniaturization will provide much lower power consumption
  for switching logic gates.

  As an example of what is currently possible with 3D printing integrated
  circuits, researchers at the [78]Air Force Research Laboratory and
  American Semiconductor recently 3D printed microcontroller SoCs from
  polymers on a flexible silicon substrate. These microcontroller units
  offer 7000x memory compared to other flexible integrated circuits at
  the time. Some envisioned applications include environmental or strain
  sensing, as well as munitions inventory monitoring.

  A flexible microcontroller integrated circuit

  A flexible microcontroller integrated circuit. This circuit was
  fabricated using polymers on silicon.

  Currently, [79]thin-film transistors (TFTs), diodes, LEDs, can be 3D
  printed from organic polymers with commercially available and
  experimental systems. The 3D-printed TFTs can have various contact/gate
  configurations and can easily be scaled horizontally and vertically.
  Polymers can be easily doped and functionalized, allowing their
  electronic and optical properties to be tuned to meet the demands of
  different devices.

  Using polymers on a semiconductor wafer is a natural route to pursue 3D
  printing integrated circuits. Electrical contacts can already be
  deposited in an additive manner through a mask (i.e., thermal
  evaporation, PVD, or CVD), followed by deposition of semiconducting
  polymers and larger conductive tracks with a 3D printer. Their
  adaptability to low-temperature processes also makes them ideal for 3D
  printing integrated circuits directly on standard semiconductor wafers.

  Other researchers are working on advancing additive manufacturing
  processes and materials to enable 3D printing integrated circuits. As
  an example, the [80]University of Hamburg and Deutsches
  Elektronen-Synchrotron developed a 3D printing process that can enable
  the fabrication of integrated circuits. This process uses a mesh of ~20
  nm silver nanowires as conductive elements and a thin film of polymer
  as an insulator or semiconducting material. This process is still in
  the research phase, but it illustrates how unique nanostructures can be
  used to fabricate semiconductor devices that rival silicon integrated
  circuits.

The Economics of 3D Printing Integrated Circuits

  In any manufacturing process, the cost structure involved in
  manufacturing is an important driver of the price of a finished device.
  Integrated circuits succeed or fail based on the cost of the die on the
  wafer—when more dies can be placed on a single wafer, the costs per
  device decreases. The cost structure of integrated circuit
  manufacturing is responsible for the high costs of highly specialized,
  low-volume integrated circuits. An excellent example can be found in
  the defense industry, where the cost of a single FPGA for a complex
  system can reach tens of thousands of dollars.

  The [81]unique cost structure of 3D printed devices changes this
  economic dynamic. 3D printed integrated circuits do not need to be
  produced on a wafer and can even be manufactured individually. Because
  3D printed devices can be produced with predictable fabrication time,
  and the cost structure is complexity agnostic, the costs involved in 3D
  printing electronics depends on the weight of the materials used. This
  makes 3D-printed integrated circuits highly cost competitive for
  low-volume production compared to devices produced on semiconductor
  wafers with standard processes.

Challenges in 3D Printing Integrated Circuits

  Commercially available printers are becoming more advanced, and the
  range of materials useful with these systems is expanding. That being
  said, there are still some challenges in 3D printing integrated
  circuits with the same level of performance as integrated circuits on
  monolithic circuits. These challenges involve finding rigid
  semiconducting materials that can be adapted to a standard 3D printing
  process, optimizing these materials for different frequency bands, and
  bringing printing resolution closer to the nanometer level.

  A flexible microcontroller integrated circuitIntegrated circuit die on
  silicon; A lithographic process may aid in 3D printing integrated
  circuits with less than one-micron resolution.

  A lithographic process may aid in 3D printing integrated circuits with
  less than one-micron resolution.

  The fact losses and parasitics can be optimized in a variety of
  polymers for specific frequency bands allows these materials to compete
  with GaN, which is currently the best option for fabricating [82]RF
  integrated circuits and SoCs. GaN is currently used in the best SoCs
  for high-frequency radar modules, as well as in power amplifiers for
  microwave and mmWave signal chains. Polymers are already used to 3D
  print substrates for building flexible and [83]nonplanar PCBs, so it is
  natural to extend these materials to integrated circuits and other
  semiconductor devices.

  To increase the printing resolution, the additive manufacturing
  industry may need to devise a completely new printing process.
  Currently, [84]inkjet 3D printing provides among the highest resolution
  features for 3D printing PCBs, but it remains to be seen if this
  process can be improved to provide resolution less than 1 micron.The
  future of 3D printing integrated circuits will likely adapt a
  photolithography process or functional self-assembly process to produce
  integrated circuits with competitive resolution.

  Innovative companies that are interested in 3D printing integrated
  circuits and fully-functional PCBs need an additive manufacturing
  system designed for full-scale production of complex electronics. The
  [85]DragonFly LDM system from Nano Dimension is ideal for in-house
  full-scale PCB fabrication of complex electronics with a planar or
  non-planar architecture. Designers can embed standard components and
  can experiment with 3D-printed integrated circuits. Read a [86]case
  study or [87]contact us today to learn more about the DragonFly LDM
  system.
   [88] [slide-in-cta-contact-3.jpg]
  Ziv Cohen

Ziv Cohen

  October 29, 2019

  Ziv Cohen has both an MBA and a bachelor’s degree in physics and
  engineering from Ben Gurion University, as well as more than 20 years
  of experience in increasingly responsible roles within R&D. In his
  latest position, he was part of Mantis Vision team—offering advanced 3D
  Content Capture and Sharing technologies for 3D platforms. The
  experience that he brings with him is extensive and varied in fields
  such as satellites, 3D, electronic engineering, and cellular
  communications. As our Application Manager, he’ll be ensuring the
  objectives of our customers and creating new technology to prototype
  and manufacture your PCBs.

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